{
    "summary": {
        "overall_match": "候选人具备2年机器视觉软件开发经验，但缺乏JD核心要求的售前支持、硬件选型及打光方案设计经验，整体匹配度一般。",
        "key_strengths": [
            "具备2年机器视觉项目经验，熟悉HALCON\/VM平台及上位机开发",
            "意向城市与到岗时间均匹配，最近一段任职超过24个月，稳定性良好"
        ],
        "key_concerns": [
            "缺乏售前需求调研、硬件选型及复杂打光方案设计经验",
            "简历偏向纯软件开发，与售前团队岗位的核心职责存在较大差异"
        ],
        "recommendation_summary": "候选人技术背景偏向纯视觉软件开发，缺乏售前及硬件光学实操经验，综合分处于谨慎推进区间，建议进一步核实其硬件选型与打光能力。"
    },
    "dimensions": [
        {
            "name": "tech_power",
            "raw_score": 60,
            "confidence_level": "medium",
            "jd_requirement": "2年以上机器视觉经验，熟练掌握视觉平台，具备扎实光学基础及打光方案设计，熟悉通信协议，归属售前团队负责硬件选型与现场交付。",
            "resume_fulfillment": "具备2年视觉软件开发经验，熟悉HALCON\/VM及通讯协议；但简历全为上位机与算法开发，缺乏硬件选型、打光方案设计及售前交付的实际项目证据，光学基础仅停留在“了解”层面。"
        },
        {
            "name": "stability",
            "raw_score": 75,
            "confidence_level": "medium",
            "jd_requirement": "无明确说明，依据历史任职年限评估。",
            "resume_fulfillment": "最近一段正式工作经历为2024.07-2026.08，时长25个月，超过24个月，视为稳定。"
        },
        {
            "name": "salary_match",
            "raw_score": 50,
            "confidence_level": "low",
            "jd_requirement": "10-15K。",
            "resume_fulfillment": "候选人期望薪资为“面议”，信息缺失，无法评估匹配度。"
        },
        {
            "name": "pace_match",
            "raw_score": 65,
            "confidence_level": "medium",
            "jd_requirement": "苏州，月休4天（单休），能适应中短期出差，无需长期驻场。",
            "resume_fulfillment": "意向城市为苏州，已离职随时到岗，地点与到岗时间匹配；但未明确说明是否接受月休4天及中短期出差安排。"
        },
        {
            "name": "communication",
            "raw_score": 95,
            "confidence_level": "high",
            "jd_requirement": "无直接要求，评估简历信息表达质量。",
            "resume_fulfillment": "简历模块清晰，项目经历包含背景、职责与结果，逻辑连贯，专业技能与项目经历一致，呈现质量高。"
        }
    ],
    "match_score": 63.3,
    "overall_confidence": 0.77,
    "recommendation": "pending_with_caution",
    "risks": {
        "hard_constraint_risks": [],
        "confirmed_high_risks": [],
        "potential_risks": [
            {
                "dimension": "tech_power",
                "description": "技术匹配原始分60，处于50-64区间。候选人缺乏售前支持、硬件选型及打光方案设计经验，需进一步核实其光学实操能力。"
            },
            {
                "dimension": "tech_power",
                "description": "核心硬性要求（硬件选型、复杂打光方案设计）仅有“了解”层面的技能声明，缺乏实际项目证据支撑，尚不足以确认完全满足。"
            }
        ]
    },
    "missing_information": [
        "候选人期望薪资未明确，无法评估薪资匹配度。",
        "候选人未明确说明是否接受月休4天（单休）及中短期出差安排。"
    ],
    "bonus_items": []
}

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