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            "major": "计算机网络技术",
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        "成像评估",
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            "duration": "2023\/03 - Present",
            "description": "负责公司光电子行业非标设备视觉系统的光学部分：项目前期打光测试、相机\/镜头\/光源选型与方案验证，支撑多条高精度设备导入。独立承担7条以上设备线的视觉光学选型与打光验证。主导量产机台视觉部分优化，在保证性能前提下完成硬件替代与方案改进，实现成本降低。"
        }
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            "name": "12 寸晶圆硅光耦合设备 · 视觉系统选型",
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        },
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            "description": "完成取料\/顶面\/底面\/侧面\/吸嘴监视等 6 类相机工位选型，顶面采用 2500 万像素高分辨率成像。排查吸嘴监视相机广角畸变问题并给出镜头改进方案；输出视觉预对位方案，支撑芯片与 FA 的耦合对准。"
        },
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            "role": "视觉选型",
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            "description": "负责贴装\/取料\/光纤角度判断\/测试等 5 个工位相机选型与打光测试，定位精度要求亚微米级。攻克玻璃贴合过程中折射与重影导致的成像难点；参与设计光纤端面圆心定位与位置关系推算的定位策略。"
        },
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            "description": "负责光纤入 V 槽、亚盖板点胶工位视觉方案：上\/下\/前\/左右\/取料\/正反识别等 7 组相机选型与成像验证，定位精度要求 ±30μm。完成背光\/同轴\/环形三种光源方案成像对比，确定背光方案边缘对比度最优，保障 V 槽定位与点胶工位稳定成像。"
        },
        {
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            "role": "视觉选型",
            "duration": "2025\/01 - 2026\/12",
            "description": "负责 4 套视觉系统（柔性振动盘定位 + 底部 + 双侧通光面检测）选型，实现麻点\/崩边\/划痕缺陷检测与产品唯一方向识别。"
        },
        {
            "name": "快速贴片机 · 光学硬件选型与测试",
            "role": "光学硬件选型与测试",
            "duration": "2025\/04 - Present",
            "description": "负责视觉定位贴装的光学硬件选型与成像测试，兼顾节拍与成像质量，完成曝光、视野与安装空间匹配验证。"
        },
        {
            "name": "FA 光纤清洗设备 · 光学选型",
            "role": "光学选型",
            "duration": "2025\/05 - 2026\/07",
            "description": "负责组装后 FA 光纤清洗设备的光学方案选型，完成清洗效果检验工位成像验证，设备已交付。"
        }
    ],
    "certifications": [],
    "self_evaluation": "4年非标自动化设备光学选型经验：独立完成工业相机、镜头、光源的选型评估与打光验证，能依据视野、精度、景深、节拍要求反向推导成像方案，累计支撑 7 条以上设备线导入。覆盖硅光\/FA 全工艺链视觉方案：晶圆级硅光耦合、单DIE测试分选、FA 组装\/清洗\/端面贴装、外观缺陷检测移栽，熟悉光纤与芯片类微小目标（亚微米级像素精度）成像难点。懂产线，不止于实验室：主导公司量产机台视觉部分优化并实现降本，具备打光测试→方案验证→量产导入→成本优化的完整闭环经验。"
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