简历解析
#546
记录详情
1-6a6b428e-15c718-7b37f45d9b4d
success
2026-07-30 20:26:38
ID
id
546
请求 ID
request_id
1-6a6b428e-15c718-7b37f45d9b4d
解析时间
parsed_at
2026-07-30 12:24:48
source_bucket
source_bucket
langbowei-static
源对象
source_object
resumes/1-6a6b428e-15c718-7b37f45d9b4d__widget_1704704635359_0.pdf
对象大小
object_size
122431
文件类型
file_type
pdf
姓名
name
余青
手机号
phone
无数据
event_name
event_name
ObjectCreated:PutObject
event_time
event_time
2026-07-30T12:24:47.000Z
region
region
cn-hangzhou
etag
etag
9085A8B2B37252BB6E2608F289482DDF
文本长度
text_length
1652
parsed_result
parsed_result
JSON
{
"basic_info": {
"name": "余青",
"gender": "女",
"phone": null,
"email": "2759247263@qq.com",
"age": "26",
"birth_date": null,
"location": null,
"work_years": "4.1"
},
"education": [
{
"school": "洛阳理工学院",
"major": "机械电子工程",
"degree": "本科",
"graduation_year": "2021"
}
],
"job_intention": {
"expected_position": "硬件工程师",
"expected_salary": "24-30K",
"expected_city": "深圳",
"availability": null
},
"skills": [
"ORCAD",
"PADS",
"CAD",
"嘉立创EDA",
"RK3288",
"RK3568",
"全志v851",
"算能sg2002",
"算能CV184",
"原理图设计",
"PCB layout",
"硬件功能调试",
"高速电路设计",
"外设接口",
"BGA焊接",
"QFN焊接"
],
"work_experience": [
{
"company": "北京竞业达数码有限责任公司",
"position": "硬件工程师",
"duration": "2025\/07 - Present",
"description": "1,负责项目的硬件开发工作,原理图和 PCB layout,协助测试,分析不良工作等;2,编写硬件相关文档;3,硬件功能调试;4,熟悉常用高速电路及外设接口;5,熟练使用烙铁,热风枪工具,可焊接 BGA,QFN 等封装芯片和常用元器件;6,熟练使用pads,orcad,嘉立创eda设计软件。在该司使用的是算能sg2002和cv184芯片,主要做的产品是人工智能通识实验课的硬件产品。"
},
{
"company": "海创半导体科技(深圳)有限公司",
"position": "硬件工程师",
"duration": "2024\/05 - 2025\/05",
"description": "1,智能门锁项目:根据客户需求完成器件选型,原理图和 PCB layout;语音项目:审核客户原理图和pcb,处理不良;2,编写硬件相关文档;3,负责语音模组及智能门锁的硬件开发;4,硬件功能调试;5,熟悉常用高速电路及外设接口;6,熟练使用烙铁,热风枪工具,可焊接 BGA,QFN 等封装芯片和常用元器件。该司使用的是全志v851芯片。"
},
{
"company": "深圳晶凌达科技有限公司",
"position": "硬件工程师",
"duration": "2023\/02 - 2024\/04",
"description": "1,根据客户需求完成器件选型,原理图和 PCB layout(6层);2,编写硬件相关文档;3,熟悉瑞芯微 RK 平台,具有多个量产项目(广告机,会议一体机,自动贩卖机,高性能多功能等智慧显示类主板);4,硬件功能调试;5,熟悉 emmc,lvds,edp,pcie,hdmi,mipi,usb 等高速电路及常用外设接口;6,熟练使用烙铁,热风枪工具,可焊接 BGA,QFN 等封装芯片和常用元器件。"
},
{
"company": "江西联益光学有限公司",
"position": "电子工程师助理",
"duration": "2021\/06 - 2023\/01",
"description": "1.熟练使用 PADS 工具;2.熟悉 PCB 的设计(封装,布线)、了解加工、SMT 流程,并能协助生产,品质分析问题和措施;3.熟悉电路板设计,具有2层&4层板的 Layout 经验;熟悉 PCB 布线的规则;4.协助电子电路的调试和相关文档编写。"
}
],
"project_experience": [
{
"name": "人工智能通识实验课硬件产品",
"role": "硬件工程师",
"duration": "2025\/07 - Present",
"description": "使用算能sg2002和cv184芯片,负责项目的硬件开发工作,原理图和PCB layout,协助测试,分析不良,硬件功能调试等。"
},
{
"name": "智能门锁及语音模组项目",
"role": "硬件工程师",
"duration": "2024\/05 - 2025\/05",
"description": "使用全志v851芯片。智能门锁项目:根据客户需求完成器件选型,原理图和PCB layout;语音项目:审核客户原理图和pcb,处理不良。负责硬件开发及功能调试。"
},
{
"name": "智慧显示类主板项目",
"role": "硬件工程师",
"duration": "2023\/02 - 2024\/04",
"description": "基于瑞芯微RK平台,完成广告机、会议一体机、自动贩卖机等智慧显示类主板的器件选型、原理图和6层PCB layout,进行硬件功能调试。"
}
],
"certifications": [
"计算机二级",
"大学英语四级"
],
"self_evaluation": "熟练使用 ORCAD,PADS,CAD 软件,有RK(RK3288,RK3568芯片)和全志(vs851)及国产算能(sg2002&CV184)等芯片的相关设计经验。"
}
output_key
output_key
parsed/resumes/1-6a6b428e-15c718-7b37f45d9b4d__widget_1704704635359_0.pdf.parsed.json
状态
status
success
error_message
error_message
无数据
raw_event
raw_event
JSON
{
"events": [
{
"eventName": "ObjectCreated:PutObject",
"eventSource": "acs:oss",
"eventTime": "2026-07-30T12:24:47.000Z",
"eventVersion": "1.0",
"oss": {
"bucket": {
"arn": "acs:oss:cn-hangzhou:1748673497100614:langbowei-static",
"name": "langbowei-static",
"ownerIdentity": "1748673497100614",
"virtualBucket": ""
},
"object": {
"deltaSize": 122431,
"eTag": "9085A8B2B37252BB6E2608F289482DDF",
"key": "resumes\/1-6a6b428e-15c718-7b37f45d9b4d__widget_1704704635359_0.pdf",
"objectMeta": {
"mimeType": "application\/pdf"
},
"size": 122431
},
"ossSchemaVersion": "1.0",
"ruleId": "6ace21aabfd5f4f41034504922b3ff7128aa76bb"
},
"region": "cn-hangzhou",
"requestParameters": {
"sourceIPAddress": "172.16.0.166"
},
"responseElements": {
"requestId": "6A6B428FC2054F3933B11016"
},
"userIdentity": {
"principalId": "300034963247836315"
}
}
]
}
创建时间
created_at
2026-07-30 20:26:38